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  3. 【Oral Presentations 】The technical conference of IEICE-ICD（Kobe Univ.)

【Oral Presentations 】The technical conference of IEICE-ICD（Kobe Univ.)

T
2023-08-01
T @ ms6siliconquantum-en
Kobe Univ.Multi-chip Cryogenic Packaging SystemOral PresentationsResearch
Title"Cryogenic Evaluation of Philip Chip Silicon Interposer for Quantum Computer"
AothersKobe Univ.MisatoTaguchi,　Ryozo Takahashi, Takuji Miki, Makoto Nagata, Masako Kato，Nobuhiro Kusuno
DateAug.1st 2023
VenueHokkaido Univ.
画像: www.edu.kobe-u.ac.jp
www.edu.kobe-u.ac.jp
T
2023-08-01
T @ ms6siliconquantum-en
Kobe Univ.Multi-chip Cryogenic Packaging SystemOral PresentationsResearch

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